EMC Compo 2021

Committees

EMC Compo 2021 Local Organising Committee

LOCAL ORGANIZING COMMITTEE

General Chair
Davy Pissoort – KU Leuven

Co-Chair
Johan Catrysse – KU Leuven

Members
Jeroen Boydens – KU Leuven

Anne Roch – TU Eindhoven

Dries Vanoost – KU Leuven

Tim Claeys – KU Leuven

Guy Vandenbosch – KU Leuven

Bart Boesman –  Melexis

Richard Perdriau – ESEO

Mohammed Ramdani – ESEO

Ramiro Serra – TU Eindhoven

Valentijn De Smedt – KU Leuven

Stephane Stroobant – KU Leuven

TECHNICAL PROGRAM COMMITTEE

Adrijan Baric, University of Zagreb

Alexandre Boyer, LAAS-CNRS

Andre Durier, IRT St Exupery

Bart Boesman, Melexis

Bernd Deutschmann, TU Graz

Bertrand Vrignon, NXP

Binhong Li, IMECAS

Bob Scully, NASA

Davide Pandini, ST Microelectronics

Davy Pissoort, KU Leuven

ErPing Li, Zhejiang University

Etienne Sicard, INSA Toulouse

Fabian Vargas, PUCRS

Franco Fiori, Politecnico di Torino

Frank Klotz, Infineon

Frederic Lafon, Valeo

Hark Byeong Park, Samsung

Hideki Sasaki, Renesas Elect. Corp.

Hugo Pues, Melexis

Hyun Ho Park, Univ. of Suwon

Jack Kruppa, Infineon

Jan Niehof, NXP

 

Jean-Michel Redoute, Univ. of Liege
 
Jeremy Raoult, Montpellier Univ.

Jianfei Wu, NUDT

Kieran O’ Leary, Mixed Signal Systems

Kamel Abouda, NXP

Makoto Nagata, Kobe University

Mart Coenen, EMCMCC

Masahiro Yamaguchi, Tohoku University

Matthieu Deloge, NXP

Mauro Merlo, ST Microelectronics

Mohamed Ramdani, ESEO

Osami Wada, Kyoto University

Ramiro Serra, TU Eindhoven

Richard Xian-Ke Gao, A*STAR

Renaud Gillon, ON Semiconductor

Richard Perdriau, ESEO

Seungyoung Ahn, KAIST

Sergey Miropolsky, Infineon

Shih-yi Yuan, Feng Chia University

Sonia Ben Dhia, LAAS-CNRS

Umberto Paoletti, Hitachi Ltd.

Wolfgang Wilkening, Bosch

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The 13th International Workshop on the Electromagnetic Compatibility of Integrated Circuits